銳凈SC-800碳化硅外延片清洗劑 | 國產替代 | 羽杰科技
?羽杰銳凈SC-800是專為SiC外延前清洗研發的高性能清洗劑。通過氧化-絡合協同技術，高效去除顆粒、金屬及有機物，實現原子級潔凈表面，完美替代進口品牌，提升外延質量與產業鏈安全。提供樣品測試。
羽杰銳凈SC800碳化硅外延片專用清洗劑產品介紹
Jie Sharp SC800 Silicon Carbide Epitaxial Wafer專用清洗劑 Product Introduction
?一、 產品概述與核心價值 | Product Overview and Core Value
羽杰銳凈SC800 是深圳市羽杰科技有限公司面向第三代半導體產業，傾力研發的旗艦型碳化硅（SiC）外延片專用清洗劑。本產品專為碳化硅襯底在外延生長前的終極精密清洗而設計，旨在一步高效去除拋光后的各類復雜污染物，為高質量外延生長提供原子級潔凈、化學態完美的表面。
Jie Sharp SC800 is a flagship proprietary cleaner for Silicon Carbide (SiC) epitaxial wafers, meticulously developed by Shenzhen Yujie Technology Co., Ltd. for the thirdgeneration semiconductor industry. Specifically designed for the ultimate precision cleaning of SiC substrates prior to epitaxial growth, it aims to efficiently remove various complex contaminants postpolishing in a single step, providing an atomically clean and chemically perfect surface for highquality epitaxial deposition.
面對當前進口清洗劑品牌溢價高、交貨周期長、技術響應慢的行業痛點，SC800以 “性能超越、供應安全、服務敏捷” 為使命，通過底層配方創新與嚴苛的品控體系，成功實現了對國際一線品牌產品的優質替代與性能超越，是提升國產碳化硅產業鏈自主可控性與競爭力的關鍵材料解決方案。
Addressing current industry pain points such as high premium costs, long delivery cycles, and slow technical support from imported cleaner brands, SC800 is committed to the mission of "performance superiority, supply security, and service agility." Through fundamental formulation innovation and a stringent quality control system, it has successfully achieved a superior alternative and performance surpassing that of leading international brands, representing a key material solution to enhance the autonomy and competitiveness of the domestic SiC supply chain.
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?二、 核心技術突破與設計理念 | Core Technological Breakthroughs and Design Philosophy
SC800的研發摒棄了傳統的單一功能思路，獨創 “協同凈化”分子設計理念，通過多重機制聯動，實現對污染物從“松動”到“剝離”再到“穩定運離”的全流程精準打擊。
The development of SC800 departs from traditional singlefunction approaches, pioneering a unique "Synergistic Purification" molecular design philosophy. It achieves precise, fullprocess removal of contaminantsfrom "loosening" to "stripping" and finally to "stable removal"through the聯動 of multiple mechanisms.
1. ?氧化絡合協同凈化機制 | OxidationChelation Synergistic Purification Mechanism
產品內置溫和可控的氧化組分與靶向多齒絡合組分。氧化組分能在襯底表面構建均一的超薄親水層，有效松動有機殘留及氧化層；隨即，高效絡合組分迅速捕捉并牢牢鎖住游離的金屬離子（如Fe、Al、Cu、Ni等）及金屬氧化物微粒，形成穩定可溶的絡合物。此協同機制從根本上解決了傳統清洗劑對“有機金屬復合污染物”清洗不徹底的難題。
The product incorporates a mild and controllable oxidizing agent and targeted multidentate chelating agents. The oxidizing agent builds a uniform, ultrathin hydrophilic layer on the substrate surface, effectively loosening organic residues and the oxide layer. Subsequently, the highly efficient chelating agents rapidly capture and securely bind free metal ions (e.g., Fe, Al, Cu, Ni) and metal oxide particles, forming stable, soluble complexes. This synergistic mechanism fundamentally solves the problem of incomplete cleaning of "organicmetal composite contaminants" by traditional cleaners.
2. ?三重表面活性劑協同矩陣 | Triple Surfactant Synergistic Matrix
創新性地復配了潤濕滲透型、生物基乳化型及靜電排斥型表面活性單元。該矩陣能瞬時降低藥液表面張力，快速滲透至污染物與SiC的納米級界面，通過潤濕、卷離、乳化等多種作用力強力剝離污染物。最關鍵的是，其獨特的靜電排斥與空間位阻效應，能有效防止已被剝離的亞微米級顆粒再次吸附到晶圓表面，確保污染物被永久性帶離，攻克了清洗中的“二次污染”核心痛點。
It innovatively formulates a compound of wettingpenetrating, biobased emulsifying, and electrostatic repelling surfactant units. This matrix instantly reduces the solution's surface tension, enabling rapid penetration into the nanoscale interface between contaminants and SiC, and forcefully strips contaminants through various forces like wetting, rollingup, and emulsification. Most crucially, its unique electrostatic repulsion and steric hindrance effects effectively prevent readsorption of stripped submicron particles onto the wafer surface, ensuring permanent contaminant removal and overcoming the core challenge of "recontamination" during cleaning.
3. ?近中性溫和腐蝕控制體系 | NearNeutral Mild Etching Control System
產品精確將工作pH值穩定在8.8±0.1的弱堿性區間。此環境既為上述協同機制提供了最佳活性舞臺，又確保了對碳化硅襯底本體的腐蝕速率降至可忽略不計的水平（經AFM驗證，表面粗糙度變化ΔRa
The product precisely maintains the operating pH within a weakly alkaline range of 8.8 ± 0.1. This environment not only provides the optimal stage for the aforementioned synergistic mechanisms but also ensures an etching rate on the SiC substrate body that is negligible (verified by AFM, surface roughness change ΔRa
四、 產品典型應用與工藝集成 | Typical Applications and Process Integration
???適用工藝環節 | Applicable Process Step: 主要用于碳化硅襯底在化學機械拋光（CMP）后、外延生長前的最終精密清洗步驟。
Primarily used for the final precision cleaning step of SiC substrates after Chemical Mechanical Polishing (CMP) and before epitaxial growth.
???兼容性 | Compatibility: 適用于主流濕法清洗設備，兼容溢流、噴霧、兆聲波（Megasonic）等多種清洗模式。與石英、PVDF、PTFE等半導體級材質完全兼容。
Compatible with mainstream wet bench清洗 equipment, supporting various cleaning modes such as overflow, spray, and Megasonic. Fully compatible with semiconductorgrade materials like quartz, PVDF, and PTFE.
???推薦工藝 | Recommended Process:
1. ?SC800主清洗 | SC800 Main Clean: 建議使用濃度100%，溫度5060°C，處理時間510分鐘（可根據污染程度調整），建議配合兆聲波能量以最大化顆粒去除效果。
Recommended concentration 100%, temperature 5060°C, process time 510 minutes (adjustable based on contamination level). Megasonic energy is recommended to maximize particle removal efficiency.
2. ?超純水（UPW）漂洗 | UltraPure Water (UPW) Rinse: 建議采用多級階梯式溢流漂洗，確保殘留藥液被徹底清除。
A multistage cascade overflow rinse is recommended to ensure complete removal of residual chemistry.
3. ?氮氣干燥 | Drying: 使用IPA干燥或熱氮氣干燥，獲得完美干爽表面。
Use IPA vapor drying or hot N2 drying to obtain a perfectly dry surface.
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?五、 品質保證與技術服務 | Quality Assurance and Technical Service
???超純品質 | UltraHigh Purity Quality: 所有批次產品均在百級潔凈環境下生產、過濾與灌裝，采用≥18.2 MΩ·cm的超純水為基質，并通過0.02μm超濾終端過濾，確保產品本身無顆粒引入風險。
All batches are manufactured, filtered, and packaged in a Class 100 cleanroom environment. Using ultrapure water (≥18.2 MΩ·cm) as the base and filtered through a 0.02μm ultrafiltration final filter to ensure the product itself introduces no particle risk.
???數據包支持 | Data Package Support: 隨貨提供詳盡的批次質量分析證書（CoA），包含關鍵離子濃度、顆粒計數、pH值、表面張力等全譜數據。
A comprehensive Certificate of Analysis (CoA) is provided with each shipment, containing fullspectrum data including key ion concentrations, particle counts, pH value, and surface tension.
???定制化支持 | Customized Support: 羽杰科技擁有強大的應用實驗室，可為客戶提供工藝調試、污染物分析、對比清洗驗證等全方位技術服務，助力客戶快速實現產線導入與良率提升。
Yujie Technology possesses a wellequipped application laboratory and can provide customers with comprehensive technical services such as process debugging, contaminant analysis, and comparative cleaning validation, assisting customers in rapid production line integration and yield improvement.
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深圳市羽杰科技有限公司致力于成為國產高端半導體材料的領航者。羽杰銳凈SC800不僅僅是一款產品，更是我們與客戶共同推進碳化硅產業國產化進程的堅實承諾。
Shenzhen Yujie Technology Co., Ltd. is committed to becoming a leader in domestic highend semiconductor materials. Jie Sharp SC800 is not merely a product; it is our solid commitment to advancing the localization of the silicon carbide industry together with our customers.
如需樣品測試或技術咨詢，敬請垂詢。 | For sample testing or technical consultation, please feel free to contact us.
本文標題：羽杰銳凈SC-800碳化硅外延片清洗劑 | 國產替代 性能超越 | 羽杰科技
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